Doctor(Engineering), Shinshu University

Material processing and microstructure control, Material processing/Microstructural control engineering

Structural materials and functional materials, Structural/Functional materials

Electron device and electronic equipment, Device related chemistry

1986, Shinshu University, Faculty of Science

Direct Cu-Cu bonding by low-temperature sintering usingthree-dimensional nanostructured plated Cu films.
S. Arai, S. Nakajima, M. Shimizu, M. Horita, M. Aizawa, O. Kiyoshi
Mater. Today Commun., 35, 175090, 2023, Refereed
Lead

Cation-Structure Effects on Zinc Electrodeposition and Crystallographic Orientation in Ionic Liquids
M. Shimizu, Y. Sugiyama, M. Horita, K. Yoshii, S. Arai
ChemElectroChem, 9, e202200016, 2022, Refereed

Electroplated Ni-P Film for Power devices without cracks induced by high temperature heating
Y. Fujimori, M. Shimizu, T. Kurashina, S. Arai
Microelectronics Reliability, 133, 114547, 2022, Refereed

粗面化めっき膜を用いた鉄鋼と樹脂の異種材料接合（解説）
新井　進
溶接技術, (5), 2-5, 2022
Lead

Superior electrical contact characteristics of Ag/CNT composite films formed in a cyanide-free plating bath and tested against corrosion by H2S gas
Arai, Susumu; Kikuhara, Taishi; Shimizu, Masahiro; Horita, Masaomi
Materials Letters, 303, 130504, 15 Nov. 2021, Refereed
Lead

Fabrication of Roughened Electrodeposited Copper Coating on Steel for Dissimilar Joining of Steel and Thermoplastic Resin
Arai, Susumu; Iwashita, Ryosuke; Shimizu, Masahiro; Inoue, Junki; Horita, Masaomi; Nagaoka, Takashi; Itabashi, Masami
Metals, 11(4), 591, 25 Apr. 2021, Refereed
Lead

Dopant Effect on Lithiation/Delithiation of Highly Crystalline Silicon Synthesized Using the Czochralski Process
Masahiro Shimizu, Kohei Kimoto, Takuya Kawai, Toshinori Taishi, Susumu Arai
ACS Appl. Energy Mater., 4, 7922-7929, 2021, Refereed

Intercalation/deintercalation of solvated Mg2+ into/from graphite interlayers
Masahiro Shimizu, Atsuhito Nakahigashi, Susumu Arai
Phys. Chem. Chem. Phys., 23, 16981-16989, 2021, Refereed

Fabrication of metal/carbon nanotube composites by electrochemical deposition (Review)
S. Arai
Electrochem, 2, 563-589, 2021, Refereed
Lead

粗面化めっき膜を利用した鉄鋼と樹脂の異種材料接合（解説）
新井　進
表面技術, 72(12), 34-38, 2021
Lead

Kinetics Study and Degradation Analysis through Raman Spectroscopy of Graphite as a Negative-Electrode Material for Potassium-Ion Batteries
Shimizu, Masahiro; Koya, Taro; Nakahigashi, Atsuhito; Urakami, Noriyuki; Yamakami, Tomohiko; Arai, Susumu
JOURNAL OF PHYSICAL CHEMISTRY C, 124(24), 13008-13016, 2020, Refereed

Dispersion of multiwalled carbon nanotubes into a diglyme solution, electrodeposition of aluminum-based composite, and improvement of hardness.
Zelei Zhang, Atsushi Kitada, Tianyu Chen, Kazuhiro Fukami, Masahiro Shimizu, Susumu Arai, Zhengjun Yao, Kuniaki Murase
Journal of Alloys and Compounds, 816, 152585, 2020, Refereed

Multi-layered copper foil reinforced by co-deposition of single-walledcarbon nanotube based on electroplating technique.
Masahiro Shimizu, Takayuki Ogasawara, Tomonari Ohnuki, Susumu Arai
Materials Letters, 261, 126993, 2020, Refereed

Excellent bonding strength between steel and thermoplastic resin using roughened electrodeposited Ni/CNT composite layer without adhesives.
Susumu Arai, Ryo Sugawara, Masahiro Shimizu, Junki Inoue, Masaomi Horita, Takashi Nagaoka, Masami Itabashi
Materials Letters, 263, 127241, 2020, Refereed
Lead

粗面化めっき法を活用した鉄鋼と樹脂の異種材料接合
新井　進
溶接学会誌, 89, 21-24, 2020
Lead

Superior Durability of Dissimilar Material Joint between Steel and Thermoplastic Resin with Roughened Electrodeposited Nickel Interlayer
Arai, Susumu; Sugawara, Ryo; Shimizu, Masahiro; Inoue, Junki; Horita, Masaomi; Nagaoka, Takashi; Itabashi, Masami
Advanced Engineering Materials, 22(12), 2000739, 2020, Refereed
Lead

Electrodeposition of Ag/CNT Composite Films from Iodide Plating Baths
Arai, Susumu; Kikuhara, Taishi; Shimizu, Masahiro; Horita, Masaomi
Journal of The Electrochemical Society, 167(12), 122515, 2020, Refereed
Lead

Fabrication of CNT/Cu Composite Yarn via Single-Step Electrodeposition
Arai, Susumu; Murakami, Ichiro; Shimizu, Masahiro; Oshigane, Akimasa
Journal of The Electrochemical Society, 167(10), 102509, 2020, Refereed
Lead

Fabrication of high thermal conductivity copper/diamond composites by electrodeposition under potentiostatic conditions.
Susumu Arai, Miyoka Ueda
Jouranl of Applied Electrochemistry, 50, 631-638, 2020, Refereed
Lead

Tin Oxides as a Negative Electrode Material for Potassium-Ion Batteries
Masahiro Shimizu, Ryosuke yatsuzuka, Taro Koya, Tomohiko Yamakami, Susumu Arai
ACS Applied Energy Materials, 1, 6865-6870, 2019, Refereed

Micro-brazing of Stainless Steel using Ni-P Alloy Plating.
Shubin Liu, Ikuo Shohji, Makoto Iioka, Anna Hashimoto, Junichiro Hirohashi, Tsunehito Wake, Susumu Arai
Applied Science, 9(6), 1094(9pages), 2019, Refereed

Morphology Control of Zinc Electrodeposition by Surfactant Addition for Alkaline-based Rechargeable Batteries.
Masahiro Shimizu, Koichi Hirahara, Susumu Arai
PHYSICAL CHEMISTRY CHEMICAL PHYSICS, 21, 7045-7052, 2019, Refereed

Alkyl-Chain-Length Dependence of Quaternary Ammonium Cation on Zn Deposition Morphology in Alkaline-based　Electrolytes.
Masahiro Shimizu, Koichi Hirahara, Yuki Ishida, Susumu Arai
Journal of The Electrochemical Society, 166(10), A2242-A2244, 2019, Refereed

Electrodeposited Cu/MWCNT composite-film: a potential current collector of silicon-based negative-electrodes for Li-ion batteries.
Masahiro Shimizu, Tomonari Ohnuki, Takayuki Ogasawara, Taketoshi Banno, Susumu Arai
RSC Advances, 9, 21939-21945, 2019, Refereed

Fabrication of high thermal conductivity Cu/diamond composites at ambient temperature and pressure.
Susumu Arai, Miyoka Ueda
AIP Advances, 9, 085309, 2019, Refereed
Lead

カーボンナノチューブ複合めっき（解説）
新井　進
溶接学会誌, 87(6), 34-39, 2018, Invited
Lead

Suppressing the effect of lithium dendritic growth by the addition of magnesium bis(trifluoromethanesulfonyl)amide.
Masahiro Shimizu, Makoto Umeki, Susumu Arai
Phys. Chem. Chem. Phys., 20, 1127-1133, 2018, Refereed

Field emission properties of a DWCNT bundle and a single MWCNT.
Masatsugu Fujishige, Winadda Wongwiriyaan, Hiroyuki Muramatsu, Kenji Takeuchi, Susumu Arai
J. Phys. Chem. Solids, 113, 229-234, 2018, Refereed

Electrochemical preparation of free-standing carbon-nanotube/Sn composite paper.
Masahiro Shimizu, Shunya Shimizu, Arinobu Katada, Mitsugu Uejima, Susumu Arai
Materials Letters, 220, 182-185, 2018, Refereed

Intercalation/De-intercalation Behavior of Li-ion Encapsulated by 12-Crown-4-Ether into Graphite Electrode.
Masahiro Shimizu, Taro Koya, Makoto Umeki, Susumu Arai
Journal of The Electrochemical Society, 165(13), A3212-A3214, 2018, Refereed

Li-insertion/extraction properties of three-dimensional Sn electrode prepared by facile electrodeposition method.
Masahiro Shimizu, Mendsaikhan Munkhbat, Susumu Arai
J. Appl. Electrochem., 47(6), 727-734, 2017, Refereed

Fabrication of Copper/Single-Walled Carbon Nanotube Composites by Electrodeposition using Free-Standing Nanotube Film
Susumu Arai, Kyohei Kirihata, Masahiro Shimizu, Miyoka Ueda, Arinobu Katada, Mitsugu Uejima
J. Electrochem. Soc., 164(13), D922-D929, 2017, Refereed
Lead

Electrochemical Na-insertion/extraction property of Ni-coated black-phosphorus prepared by an electroless deposition method.
Masahiro Shimizu, Yuji Tsushima, Susumu Arai
ACS OMEGA, 2(8), 4306-4315, 2017, Refereed

Design of roughened current collector by bottom-up approach using the electroplating technique: charge-discharge performance of a Sn negative-electrode for Na-ion batteries.
Masahiro Shimizu, Ryosuke Yatsuzuka, Masaomi Horita, Takahiro. Yamamoto, Susumu Arai
J. Phys. Chem. C, 121(49), 27285-27294, 2017, Refereed

Micro-Scale Columnar Architecture Composed of Copper Nano Sheets by Electrodeposition Technique.
Susumu Arai, Masaya Ozawa, Masahiro Shimizu
J. Electrochem. Soc., 164(2), D72-D74, 2017, Refereed
Lead

Fabrication of a uniformly tin-coated three-dimensional copper nanostructured architecture by electrodeposition.
Susumu Arai, Munkhbat Mendsaikhan, Koichi Nishimura
Journal of The Electrochemical Society, 163(2), D54-D56, 2016
Lead

A carbon nanotube-reinforced noble tin anode structure for lithium-ion batteries.
Susumu Arai, Ryosuke Fukuoka
Journal of Applied Electrochemistry, 46(3), 331-338, 2016
Lead

Fabrication of copper/single-walled carbon nanotube composite film with homogeneously dispersed nanotubes by electroless deposition.
Susumu Arai, Takuma Osaki, Mitsuhito Hirota, Mitsugu Uejima
Mater Today Commun., 7, 101-107, 2016, Refereed
Lead

Fabricaion of Three-Dimensional (3D) Copper/Carbon Nanotube Composite Film by One-Step Electrodeposition.
Susumu Arai, Masaya Ozawa, Masahiro Shimizu
J. Electrochem. Soc., 163(14), D774-D779, 2016, Refereed
Lead

ダイヤモンドおよびカーボンナノチューブを用いた複合めっき膜の熱特性
新井　進
表面技術, 66(6), 252-255, 2015
Lead

カーボンナノチューブ複合めっき膜の作製とその特性
新井　進
防錆管理, 59(7), 1-6, 2015
Lead

Fabrication of copper/multiwalled carbon nanotube composites containing different sized nanotubes by electroless deposition
Susumu Arai, Takuma Osaki
J. Electrochem. Soc., 162(1), D68-D73, 2015, Refereed
Lead

Simple Method for Fabrication of Three-Dimensional (3D) Copper Nanostructured Architecture by Electrodeposition
Susumu Arai, Tomoya Kitamura
ECS Electrochemistry Letters, 3(5), D1-D3, May 2014, Refereed
Lead

カーボンナノチューブを用いた複合めっき
新井　進
表面技術, 65(2), 20-25, Feb. 2014, Refereed
Lead

電析Co/Cu多層膜の層厚に依存した磁気特性の変化
高根直人，成田　博，曽根原浩幸，劉　小晰，新井　進
表面技術, 65(2), 99-103, Feb. 2014, Refereed

Electroless deposition of Cu/multiwalled carbon nanotube composite films with improved frictional properties
Susumu Arai, Taishi Kanazawa
ECS J. Solid State Sci. Technol., 3(6), P201-P206, 2014, Refereed
Lead

Electroless deposition and evaluation of Cu/multiwalled carbon nanotube composite films on acrylonitrile butadiene styrene resin
Susumu Arai, Taishi Kanazawa
Surf. Coat. Technol., 254(0), 224-229, 2014, Refereed
Lead

Magnetic Properties and Microstructure of Electrodeposited Co/Cu Multilayers
Naoto Takane, Hiroshi Narita, Xiaoxi Liu, Susumu Arai
Electrochemistry, 81(12), 966-970, Dec. 2013, Refereed

Fabrication of Co-W Alloy/Multiwalled Carbon Nanotube Composite Films by Electrodeposition for Improved Frictional Properties
Susumu Arai, Kazuaki Miyagawa
ECS Journal of Solid State Science and Technology, 2(11), M39-M43, Nov. 2013, Refereed
Lead

Mechanism for Codeposition of Multiwalled Carbon Nanotubes with Copper form Acid Copper Sulfate Bath
Susumu Arai, Akihiro Kato
Journal of The Electrochemical Society, 160(9), D380-D385, Sep. 2013, Refereed
Lead

Frictional and wear properties of cobalt/multiwalled carbon nanotube composite films formed by electrodeposition
Susumu Arai, Kazuaki Miyagawa
Surface & Coatings Technology, 235, 204-211, Jul. 2013, Refereed
Lead

Field emission properties of cobalt/multiwalled carbon nanotube composite films fabricated by electrodeposition
Susumu Arai, Kazuaki Miyagawa
Applied Surface Science, 280, 957-961, May 2013, Refereed
Lead

Crystal structure of Co/Cu multilayers prepared by pulse potential electrodeposition with precisely controlled ultrathin layer thickness
Naoto Takane, Hiroshi Narita, Yasuko Kurogouchi, Susumu Arai
AIP Advances, 3, 022119, 2013, Refereed

Field emission properties of Cu/multiwalled carbon nanotube composite films fabricated by an electrodeposition technique
Susumu Arai, Eri Shinada, Morinobu Endo
Journal of Applied Electrochemistry, 43(4), 399-405, 2013, Refereed
Lead

Fabrication of metal coated carbon nanotubes by electrodeposition for improved wettability with molten aluminum
Susumu Arai, Yosuke Suzuki, Junshi Nakagawa, Tohru Yamamoto, Morinobu Endo
Surface & Coatings Technology, 212, 207-213, 2012, Refereed
Lead

Effectiveness of Coulostatic Electrodeposition of Multilayers
Naoto Takane, Hiroshi Narita, Susumu Arai
Journal of the Surface Finishing Society of Japan, 62(9), 463-468, Sep. 2011, Refereed

Improved Electrodeposited Multilayer Structure by Coulomb Controller
Naoto Takane, Hiroshi Narita, Susumu Arai
Electrochemistry, 79(7), 558-560, Jul. 2011, Refereed

Electroless Deposition of Silver on Multiwalled Carbon Nanotubes Using Iodide Bath
Susumu Arai, Junko, Fujii
Journal of The Electrochemical Society, 158(8), D506-D510, Jun. 2011, Refereed
Lead

Fabrication of Ni-B alloy coated vapor-grown carbon nanofibers by electroless deposition
Susumu Arai, Yuzo Imoto, Yosuke Suzuki, Morinobu Endo
Carbon, 49(4), 1484-1490, Apr. 2011, Refereed
Lead

Development of Measurement and Analysis for Electrolytic Current and Application to Multilayer Electrodeposition with a Coulomb Controller
Naoto Takane, Hiroshi Narita, Susumu Arai
Electrochemistry, 79(3), 156-162, 2011, Refereed

Fabrication of various electroless Ni-P alloy/multiwalled carbon nanotube composite films on an acrylonitrile butadiene styrene resin
Susumu Arai, Toshihiko Sato, Morinobu Endo
Surface & Coatings Technology, 205, 3175-3181, 2011, Refereed
Lead

Cu/Multiwalled Carbon Nanotube Composite Films Fabricated by Pulse-Reverse Electrodeposition
Susumu Arai, Yoriyuki Suwa, Morinobu Endo
Journal of The Electrochemical Society, 158(2), D49-D53, Dec. 2010, Refereed
Lead

Ni-P Alloy - Carbon Black Composite Films Fabricated by Electrodeposition
Yosuke Suzuki, Susumu Arai, Morinobu Endo
Applied Surface Science, 256(22), 6914-6917, Sep. 2010, Refereed

Fabrication of Various Electroless Ni-P Alloy/Multiwalled Carbon Nanotube Composite Films and Their Frictional Properties
Susumu Arai, Takashi Saito, Morinobu Endo
Journal of The Electrochemical Society, 157(11), D570-D576, Sep. 2010, Refereed
Lead

Pure-Nickel-Coated Multiwalled Carbon Nanotubes Prepared by Electroless Deposition
Susumu Arai, Mitsuhiko Kobayashi, Tohru Yamamoto, Morinobu Endo
Electrochemical and Solid-State Letters, 13(12), D94-D96, Sep. 2010, Refereed
Lead

Electric Contact Characteristics Under Low Load of Silver-Carbon Nanotube Composite Plating Film Corroded Using H2S Gas
Fujishige Masatsugu, Mitsuru Sekino, Kazunori Fujisawa, Shingo Morimoto, Kenji Takeuchi, Susumu Arai, Akimasa Kawai
APPLIED PHYSICS EXPRESS, 3(6), 065801(1-3), 2010, Refereed

Effects of Additives on Cu-MWCNT Composite Plating Films
Arai, Susumu; Saito, Takashi; Endo, Morinobu
Journal of The Electrochemical Society, 157(3), D127-D134, 2010, Refereed
Lead

Cu-MWCNT Composite Films Fabricated by Electrodeposition
Arai, Susumu; Saito, Takashi; Endo, Morinobu
Journal of The Electrochemical Society, 157(3), D147-D153, 2010, Refereed
Lead

Boron Particle Composite Plating with Ni-B Alloy Matrix
Arai, Susumu; Kasai, Shuji; Shohji, Ikuo
Journal of The Electrochemical Society, 157(2), D119-D125, 2010, Refereed
Lead

Electrodeposition of Ni-P Alloy-Multiwalled Carbon Nanotube Composite Films
Suzuki, Yosuke; Arai, Susumu; Endo, Morinobu
Journal of The Electrochemical Society, 157(1), D50-D53, 2010, Refereed

Phosphorus Particle Composite Plating with Ni-P Alloy Matrix
Yosuke Suzuki, Susumu Arai, Ikuo Shohji, Eiji Kobayashi
Journal of The Electrochemical Society, 156(8), D283-D286, Jul. 2009, Refereed

ナノ結晶の硬質純金めっき膜を用いたプローブの電気接点特性の向上
藤重雅嗣、新井　進、王　峰、牛山幹夫、朴　基哲、竹内健司、森本信吾、遠藤守信
電子情報通信学会誌C, J92-C, 218-224, 2009, Refereed

Gold-Carbon Nanotube Composite Plating Film Deposited Using Non-Cyanide Bath
Masatsugu Fujishige, Winadda Wongwiriyapan, Feng Wang, Ki Chul Park, Kenji Takeuchi, Susumu Arai, Morinobu Endo
Japanese Journal of Applied Physics, 48, 070217(1-3), 2009, Refereed

マグネシウム合金溶湯に対するVGCFのぬれ性改善を目的とした表面改質処理
佐藤智之、加藤敦史、新井啓太、滝沢秀一、新井　進
表面技術, 59(4), 265-267, 2008, Refereed

Electrodeposition of Ni-P composite films using Watts base base containing phosphorus particles
Yosuke Suzuki, Susumu Arai, Ikuo Shohji, Eiji Kobayashi
表面技術, 59(5), 343-345, 2008, Refereed

Inter-collisional cutting of multi-walled carbon nanotubes by high-speed agitation
Ki Chul Park, Masatsugu Fujishige, Kenji Takeuchi, Susumu Arai, Shingo Morimoto, Morinobu Endo
JOURNAL OF PHYSICS AND CHEMISTRY OF SOLIDS, 69, 2481-2486, 2008, Refereed

Excellent solid lubrication of electrodeposited nickel-multiwalled carbon nanotube composite films
Susumu Arai, Akihiro Fujimori, Masami Murai, Morinobu Endo
Materials Letters, 62(20), 3545-3548, 2008, Refereed
Lead

Metal-Fixed Multiwalled Carbon Nanotube Patterned Emitters Using Photolithography and Electrodeposition Technique
Susumu Arai, Takashi Saito, Morinobu Endo
Electrochemical and Solid-State Letters, 11(9), D72-D74, 2008, Refereed
Lead

Cu-P複合めっき
新井　進、鈴木陽介、飯高正裕、荘司郁夫、上西正久、大友　昇
表面技術, 58(2), 139-141, 2007, Refereed
Lead

Cu-P複合めっき膜のろう付特性に及ぼす添加P粒子径の影響
荘司郁夫、新井　進、狩野直樹、上西正久、大友　昇
表面技術, 58(12), 831-835, 2007, Refereed

無電解Ni-Pめっき処理アルミニウム合金とポリアセタールとの磨耗特性
荘司郁夫、新井　進、内川順一、松井孝典、小林栄仁
表面技術, 58(12), 846-850, 2007, Refereed

Development of Cu Brazing Sheet with Cu-P Composite Plating
Ikuo Shohji, Susumu Arai, Naoki Kano, Noboru Otomo, Masahisa Uenisih
Key Engineering Materials, 353-358, 2025-2028, 2007, Refereed

Low-internal-stress nickel multiwalled carbon nanotube composite electrodeposited from a sulfamate bath
Susumu Arai, Takashi Saito, Morinobu Endo
Journal of The Electrochemical Society, 154(10), D530-D533, 2007, Refereed
Lead

カーボンナノチューブ複合めっき
新井　進、遠藤守信
表面技術, 57(7), 471-474, 2006
Lead

めっき講座Ⅳ（電気めっき　すず、鉛、すずー鉛合金、鉛フリーはんだめっき）
新井　進
防錆管理, 51(2), 65-70, 2006
Lead

Synthesis of carbon nanotube-supported nickel-phosphorus nanoparticles by an electroless process
Feng Wang, Susumu Arai, Ki Chul Park, Kenji Takeuchi, Yong Jung Kim, Morinobu Endo
Carbon, 44, 1298-1352, 2006, Refereed

Fabrication of Nickel-multiwalled carbon nanotube composite films with excellent thermal conductivity by an electrodeposition technique
Susumu Arai, Morinobu Endo, Tomoyuki Sato, Atsushi Koide
Electrochemical and Solid-State Letters, 9, C131-C133, 2006, Refereed
Lead

Various carbon nanofiber-copper composite films prepared by electrodeposition
Susumu Arai, Morinobu Endo
Electrochemistry Communications, 7, 19-22, 2005, Refereed
Lead

Preparation of nickel-carbon nanofiber composites by a pulse-reverse electrodeposition process
Feng Wang, Susumu Arai, Morinobu Endo
Electrochemistry Communications, 7, 674-678, 2005, Refereed

The preparation of multi-walled carbon nanotubes with a Ni-P coating by an electroless deposition process
Feng Wang, Susumu Arai, Morinobu Endo
Carbon, 43, 1716-1721, 2005, Refereed

鉛フリーはんだ接合に対応した硫酸浴からのSn-Ag-Cu合金めっき
金子紀男、駒津基靖、倉科　匡、新井　進、篠原直行
電気化学および工業物理化学, 73(11), 951-955, 2005, Refereed

はんだの鉛フリー化に対応しためっき技術の現状と課題
新井　進
表面技術, 55(9), 576-581, 2004
Lead

Effect of S on Passivation of Ni Plating
Susumu Arai, Takahide Hasegawa, Norio Kaneko
Journal of The Electrochemical Society, 151(1), C15-C18, 2004, Refereed
Lead

Fabrication of Three-dimensional Cu/Ni Multilayered Microstructure by Wet Process
Susumu Arai, Takahide Hasegawa, Norio Kaneko
Electrochimica Acta, 49, 945-950, 2004, Refereed
Lead

Electrochemical preparetion and characterization of nickel/ultra-dispersed PTFE composite films from aqueous solution
Feng Wang, Susumu Arai, Morinobu Endo
Materials Transactions, 45(4), 1311-1316, 2004, Refereed

Metallization of multi-walled carbon nanotubes with copper by an electroless deposition process
Feng Wang, Susumu Arai, Morinobu Endo
Electrochemistry Communications, 6, 1042-1044, 2004, Refereed

Ni--fluorinated Vapor Growth Carbon Fiber (VGCF) Composite Films Prepared by an Electrochemical Deposition Process
Feng Wang, Susumu Arai, Shingo Morimoto, Morinobu Endo
Electrochemistry Communications, 6, 242-244, 2004, Refereed

Electrodeposition of Au-Sn Alloy from Sulfite-Pyrophosphate Bath
Yoshikazu Funaoka, Susumu Arai, Norio Kaneko
Electrochemistry, 72(2), 98-102, 2004, Refereed

Carbon Nanofiber-Copper Composites Fabricated by Electroplating
Susumu Arai, Morinobu Endo
Electrochemical and Solid-State Letters, 7(3), C25-C26, 2004, Refereed
Lead

Ni-deposited Multi-walled Carbon Nanotubes by Electrodeposition
Susumu Arai, Morinobu Endo, Norio Kaneko
Carbon, 42, 641-644, 2004, Refereed
Lead

Ni-coated carbon nanofibers prepared by electroless deposition
Susumu Arai, Morinobu Endo, Shinji Hashizume, Yasuho Shimojima
Electrochemistry Communications, 6, 1029-1031, 2004, Refereed
Lead

N,N-ﾋﾞｽ(ﾎﾟﾘｵｷｼｴﾁﾚﾝ)ｵｸﾀﾃﾞｼﾙｱﾐﾝを添加剤とする硫酸浴からの鉛フリーはんだ接合に対応したSn-Ag合金めっき
金子紀男，白矢優貴，新井　進，篠原直行
電気化学および工業物理化学, 71(5), 322-326, 2003, Refereed

Carbon Nanofiber-Copper Composite Powder Prepared by Electrodeposition
Susumu Arai, Morinobu Endo
Electrochemistry Communications, 5, 797-799, 2003, Refereed
Lead

電気めっき法による硫酸浴からのSn-Cuはんだバンプの作製
金子紀男，関　雅子，新井　進，篠原直行
電気化学および工業物理化学, 71(9), 791-794, 2003, Refereed

Sn-Ag Solder Bump Formation for Flip-Chip Bonding by Electroplating
Susumu Arai, Hideki Akatsuka, Norio Kaneko
Journal of The Electrochemical Society, 150(10), C730-C734, 2003, Refereed
Lead

Fabrication of 3-D Ni/Cu Multilayered Microstructure by Selective Etching of Ni
Susumu Arai, Takahide Hasegawa, Norio Kaneko
Journal of The Electrochemical Society, 150(11), C798-C801, 2003, Refereed
Lead

鉛フリーはんだの現状と展望　電気めっき法による鉛フリーはんだバンプの作製
新井　進
科学と工業, 76(10), 525-531, 2002

Electroless Sn-Ag Alloy Plating by Displacement Reaction
Susumu Arai, Masanobu Kumagai, Norio Kaneko, Naoyuki Shinohara
Electrochemistry, 70(5), 311-315, 2002, Refereed
Lead

はんだの鉛フリー化に対応しためっき技術の現状
新井　進、金子紀男、篠原直行
表面技術, 52(5), 369-373, 2001
Lead

電気めっき法によるフリップチップ接合用鉛フリーはんだバンプの作製
新井　進、金子紀男、篠原直行
セラミックス, 36(6), 430-433, 2001
Lead

電析したSn-Ag-Cu三元合金の微細構造
新井　進、金子紀男、篠原直行
表面科学, 22(7), 463-469, 2001, Refereed
Lead

電位パルス電解法によるCu/Cu-Sn合金積層皮膜の作製
篠原直行、新井　進、金子紀男、若林信一
表面技術, 52(10), 693-697, 2001, Refereed

Polarographic Study on the Smoothing of Sn-Ag Alloy Film Electrodeposited from Pyrophosphate Iodide Bath
Susumu Arai, Norio Kaneko, Naoyuki Shinohara
Electrochemistry, 69(4), 254-258, 2001, Refereed
Lead

鉛フリーはんだ接合に対応した硫酸浴からのSn-Cu合金めっき
金子紀男，関　雅子，新井　進，篠原直行
電気化学および工業物理化学, 69(5), 329-334, 2001, Refereed

Electrodeposition of Sn-Cu Alloy from Pyrophosphate Bath
Susumu Arai, Yoshikazu Funaoka, Norio Kaneko, Naoyuki Shinohara
Electrochemistry, 69(5), 319-323, 2001, Refereed
Lead

ASTM腐食水中におけるDICHANのSPCCへの腐食抑制機構の電気化学的評価
新井　進，篠原直行，金子紀男
防錆管理, 44(2), 41-44, 2000, Refereed
Lead

ASTM腐食水中におけるDICHANのSPCCへの腐食抑制機構のSTMによるin-situ評価
新井　進，篠原直行，金子紀男
防錆管理, 44(3), 81-85, 2000, Refereed
Lead

日本における溶接の展望1998 (Ⅲ-4 マイクロ接合)
新井　進
溶接学会誌, 68(5), 376-378, 1999
Lead

鉛フリーはんだ接合に対応しためっきの現状
新井　進，篠原直行，金子紀男
まてりあ, 38(12), 951-955, 1999
Lead

Pbフリーはんだ用Sn-Ag合金めっき
新井　進，渡邊　徹
表面技術, 49(1), 73-77, 1998, Refereed
Lead

非シアン浴からのスズ－銀合金めっき
新井　進
表面技術, 49(3), 230-234, 1998
Lead

日本における溶接の展望1997 (Ⅲ-4 マイクロ接合)
新井　進
溶接学会誌, 67(5), 405-407, 1998
Lead

Microstructure of Sn-Ag Alloys Electrodeposited from Pyrophosphate-Iodide Solutions
Susumu Arai, Tohru Watanabe
Materials Transactions, JIM, 39(4), 439-445, 1998, Refereed
Lead

日本における溶接の展望1996（Ⅲ-４　マイクロ接合）
新井　進
溶接学会誌, 66(5), 361-363, 1997
Lead

Electrodeposition of Sn-Ag-Cu Alloys
Susumu Arai, Norio Kaneko
Electrochemistry, 65(12), 1102-1106, 1997, Refereed
Lead

Electrodeposition of Sn-Ag Alloy with a Non-Cyanide Bath
Susumu Arai, Tohru Watanabe
Electrochemistry, 65(12), 1097-1101, 1997, Refereed
Lead

低温純水中におけるAl-Mg合金表面の酸化膜成長過程
塩沢玲子、沖　恭一、新井　進
材料と環境, 45(10), 609-613, 1996, Refereed

電析したSn-Ag合金の結晶構造と微細組織
新井　進、渡邊　徹
日本金属学会誌, 60(12), 1149-1154, 1996, Refereed
Lead

水洗浄工程における鉄鋼の防錆
新井　進、小池明夫、仁科耕一、鳥羽正司
防錆管理, 39(2), 52-57, 1995, Refereed
Lead

過剰電流密度で電析したニッケル皮膜
新井　進
表面技術, 44(4), 336-340, 1993, Refereed
Lead

過剰電流密度で形成したニッケルめっきのはんだ付性
新井　進、竹本　正、水谷正海、征矢　隆
表面技術, 44(1), 50-54, 1993, Refereed

水素チャージしたニッケルおよび銅のはんだ付性
新井　進
表面技術, 43(11), 1079-1080, 1992, Refereed
Lead

接着界面解析と次世代接着接合技術
新井　進, Joint work
エヌ・ティー・エス, 325-332 Jan. 2022

ナノカーボン・ナノセルロースの分散・配向制御技術
新井　進, Joint work
CMC出版, 67-77頁 2021

リチウムイオン二次電池用炭素系負極材の開発動向，第II編第7章 めっき技術を用いたリチウムイオン電池用CNT/Sn電極の開発
清水雅裕、新井 進, Joint work
CMC出版, 104-110頁 2019

リチウムイオン二次電池用シリコン系負極材の開発動向，第 II 編第3章 シリコン負極用高比表面積銅系集電体
清水雅裕、新井 進, Joint work
CMC出版, 172-182頁 2019

カーボンナノチューブの表面処理・分散技術と複合化事例，第7章第3節 カーボンナノチューブ複合めっき基板の集電体への応用
清水雅裕、新井 進, Joint work
CMC出版, 232-239頁 2019

Novel Metal Electrodeposition and the Application toward MEMS Device
Masatsugu Fujishige and Susumu Arai, Joint work, Hard Pure-Gold and Gold-CNT Composite Plating using Electrodeposition Technique with Environmentally Freiendly Sulfite Bath.
InTech, 17pages 2018

次世代電池用電極材料の高エネルギー密度、高出力化－リチウム過剰系正極、三元系正極、シリコン系負極、ポストリチウムイオン電池－（分担執筆）
清水雅裕、新井 進, Joint work
情報技術協会, pp.422-431 Nov. 2017

最新フォトレジスト材料開発とプロセス最適化技術「フォトレジストを用いた電気めっき法による微細金属構造の創製」（分担執筆）
新井　進、清水雅裕, Joint work
CMC出版, pp.261-269 Jan. 2017

カーボンナノチューブ・グラフェン分散技術の工業化と機能展開
新井　進, Joint work
S&T出版, 39-48頁 26 Feb. 2014

マイクロ接合・実装技術
新井　進, Joint work
㈱産業技術サービスセンター技術サービスセンター, 57-62頁 Jul. 2012

標準マイクロソルダリング技術第3版
新井　進, Joint work
日刊工業新聞社, 81-85頁 Mar. 2011

ナノカーボンハンドブック
新井　進, Joint work
エヌ・ティー・エス, 449-453頁 Jul. 2007

環境対応型表面処理技術
新井　進, Joint work
㈱テクノシステム, 323-332頁 Aug. 2005

標準マイクロソルダリング
新井　進, Joint work
日刊工業新聞社, 35-39頁 Aug. 2002

「防食・防錆技術総監」
新井　進, Joint work
㈱産業技術サービスセンター, 915-918頁 May 2000

American Chemical Society

The Chemical Society of Japan

The Electrochemical Society of Japan

The Japan Institute of Metals and Materials

The Japan Society for Analytical Chemistry

The Japan Institute of Electronics Packaging

The surface finishing society of japan

Japan Welding Society

The Carbon Society of Japan

The Electrochemical Society

Smart Processing Society for Materials, Environment & Energy

カーボンナノチューブ複合めっき法を活用した新規リチウムイオン電池負極構造の構築（基盤研究B）
科学研究費補助金, JSPS
2014 - 2016

電鋳端子用めっき液とめっき膜の開発
共同研究, 精研㈱
2014 - 2014

CNTめっきによる複合材料膜の作製
共同研究, KOA㈱
2014 - 2014

貴金属複合めっきの研究
共同研究, オリンパス㈱
2014 - 2014

めっき技術によるSGCNT/Cu複合化技術開発
共同研究, 日本ゼオン㈱
2013 - 2014

電解Ruめっき皮膜の特性に関する研究
共同研究, 日本エレクトロプレイティング・エンジニャース㈱
2013 - 2014

鍍金技術によるブレーキキャリパー用アルミピストンの表面特性向上
共同研究, 日信工業㈱
2013 - 2014

グリーンイノベーション研究支援事業『導電性シリコン粒子を用いた次世代蓄電池用負極の創製』
信州大学
2013 - 2013

炭素材料複合めっきに関する研究
共同研究, 新光電気工業㈱
2013 - 2013

カーボン複合めっきの研究開発
共同研究, パナソニック㈱
2013 - 2013

電鋳端子用めっき液とめっき膜の開発
共同研究, 精研㈱
2013 - 2013

炭素材料複合めっきに関する研究
共同研究, 新光電気工業㈱
2011 - 2012

ナノカーボン複合めっきの研究開発
共同研究, パナソニック㈱
2011 - 2011

カーボンナノチューブ複合めっきの共析メカニズムの解明（基盤研究C）
科学研究費補助金, JSPS
2010 - 2012

炭素材料複合めっきに関する研究
共同研究, 新光電気工業㈱
2010 - 2011

カーボンナノチューブ複合めっきの研究開発
共同研究, パナソニック電工㈱
2010 - 2010

工学研究助成
西工業㈱
2010

CNT複合銅めっきに関する研究
共同研究, 新光電気工業㈱
2009 - 2010

機能性表面処理皮膜の作製・評価
受託事業, 長野県工業技術センター
2009 - 2009

低抵抗・低ＴCRめっきの開発
共同研究, KOA㈱
2009 - 2009

複合めっきによるはんだ鏝先の高寿命化
共同研究, 長野沖電気㈱
2009 - 2009

ナノカーボン複合めっきの研究開発
共同研究, パナソニック電工㈱
2009 - 2009

工学研究助成
村田製作所㈱
2009

工学研究助成
富士電機デバイステクノロジー
2009

工学研究助成
西工業㈱
2009

経済産業省戦略的基盤技術高度化支援事業『ナノ粒を用いた高機能複合めっき加工技術の開発』
経済産業省戦略的基盤技術高度化支援事業
2008 - 2010

白金複合めっき
共同研究, ㈱カワジュンインダストリー
2008 - 2009

ナノカーボン複合めっきの研究開発
共同研究, 松下電工㈱
2008 - 2008

めっき皮膜計測方法の確立
共同研究, KOA㈱
2008 - 2008

高機能複合めっきの研究
共同研究, ㈱メイコー
2008 - 2008

工学研究助成
富士電機デバイステクノロジー
2008

機能性炭素系複合めっきの開発
共同研究, ｾｲｺｰｴﾌﾟｿﾝ㈱
2007 - 2008

ナノカーボン複合めっきの研究開発
共同研究, 松下電工㈱
2007 - 2007

高機能複合めっきの研究
共同研究, ㈱メイコー
2007 - 2007

複合めっきの研究開発
共同研究, 信越富士通㈱
2007 - 2007

Ni合金複合めっきによるアルミニウム製機構部品の表面硬化
共同研究, 仁テック（有）
2007 - 2007

工学研究助成
信越富士通㈱
2007

工学研究助成
中澤鋳造
2007

機能性複合めっきの開発
共同研究, ｾｲｺｰｴﾌﾟｿﾝ㈱
2006 - 2007

機能性ナノコンポジット複合めっきの開発に関する研究
共同研究, ㈱しなの富士通
2006 - 2007

Ni合金複合めっきの開発
共同研究, 日精樹脂工業㈱
2006 - 2007

ニッケル/潤滑性ナノ粒子複合めっき浴の開発
受託事業, 福島県ハイテクプラザ
2006 - 2006

機能めっきによる接点の性能向上に関する研究
共同研究, ㈱エルグ
2006 - 2006

鉛フリー化に伴うPT基板表面処理の研究開発
共同研究, ㈱メイコー
2006 - 2006

銅材料の表面に複合めっき法によりろう材層を製造する実用化(量産化）研究
共同研究, ㈱アタゴ製作所
2006 - 2006

カーボンナノチューブ複合めっきの研究開発
共同研究, 松下電工㈱
2006 - 2006

工学研究助成
メイコー
2006

分散めっき法によるCu-P合金膜の作製
共同研究, ㈱アタゴ製作所
2005 - 2005

ナノ粒子分散めっき法によるアルミニウム表面硬化層の創製
共同研究, 仁テック
2004 - 2004

分散めっき法によるCu-P合金膜の作製
共同研究, ㈱アタゴ製作所
2004 - 2004

工学研究助成
荘司郁夫
2003

めっき法による多層電極形成技術開発
共同研究, 三菱電機（株）先端技術総合研究所
2002 - 2002

工学研究助成
三菱電機（株）先端技術総合研究所
2002

NEDOプロジェクト『鉛フリーはんだ規格化等研究開発』
NEDO
1998 - 1999

Fabrication of carbon nanotube/metal composite yarns by electrodeposition

Dissimilar Materials Joining using Plating Techniques

Carbon Nanotube Composite Plating

Functional Alloy Plating