Doctor(Engineering), Shinshu University

Material processing and microstructure control, Material processing/Microstructural control engineering

Structural materials and functional materials, Structural/Functional materials

Electron device and electronic equipment, Device related chemistry

1986, Shinshu University, Faculty of Science

Selective Zn/Na ions Insertion into FePO4 Positive Electrode Tuned by Counter Anions in Aqueous Zn-Based Rechargeable Batteries
Shimizu, Masahiro; Tsuchikane, Koki; Inoue, Junki; Arai, Susumu
CHEMELECTROCHEM, 11(4), e202300540, 2024

Fabrication of Ag-Bi Alloy Films from an Iodide-Tartrate Bath via Current Pulse Electrodeposition
Arai, Susumu; Hara, Minori; Horita, Masaomi; Shimizu, Masahiro; Kikuhara, Taishi
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 171(2), 22504, 2024
Lead

カーボンナノチューブを用いた複合めっき
Arai, Susumu
材料の科学と工業, 61(2), 22-25, 2024
Lead

Direct Cu-Cu bonding by low-temperature sintering using three-dimensional nanostructured plated Cu films
Arai, Susumu; Nakajima, Soichiro; Shimizu, Masahiro; Horita, Masaomi; Aizawa, Mitsuhiro; Kiyoshi, Oi
MATERIALS TODAY COMMUNICATIONS, 35, 175090, 2023, Refereed
Lead

Substrate thermal expansion coefficient effect on cracks induced by the high-heat treatment of electroplated Ni-P films for power devices
Fujimori, Yuji; Shimizu, Masahiro; Kurashina, Tadashi; Arai, Susumu
MATERIALS LETTERS, 350, 134869, 2023

Lithiation/delithiation of silicon heavily doped with boron synthesized using the Czochralski process
Shimizu, Masahiro; Kimoto, Kohei; Kikuchi, Ayaka; Taishi, Toshinori; Arai, Susumu
ENERGY ADVANCES, 2(6), 813-819, 2023

Electrodeposition of Fe-Ni Alloy Films having Invar Compositions with Fe3+ as the Sole Iron Source
Arai, Susumu; Tomiita, Koyuru; Shimizu, Masahiro; Narita, Haruhi
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 170(11), 112506, 2023
Lead

Protonation/Deprotonation of Rutile TiO2 in Acid Aqueous Electrolytes
Shimizu, Masahiro; Nishida, Daisuke; Kikuchi, Ayaka; Arai, Susumu
JOURNAL OF PHYSICAL CHEMISTRY C, 127(36), 17677-17684, 2023

Cation-Structure Effects on Zinc Electrodeposition and Crystallographic Orientation in Ionic Liquids
Shimizu, Masahiro; Sugiyama, Yusuke; Horita, Masaomi; Yoshii, Kazuki; Arai, Susumu
CHEMELECTROCHEM, 9(10), e202200016, 2022, Refereed

Electroplated Ni-P film for power devices without cracks induced by high temperature heating
Fujimori, Yuji; Shimizu, Masahiro; Kurashina, Tadashi; Arai, Susumu
MICROELECTRONICS RELIABILITY, 133, 114547, 2022, Refereed

粗面化めっき膜を用いた鉄鋼と樹脂の異種材料接合（解説）
新井　進
溶接技術, (5), 2-5, 2022
Lead

Superior electrical contact characteristics of Ag/CNT composite films formed in a cyanide-free plating bath and tested against corrosion by H2S gas
Arai, Susumu; Kikuhara, Taishi; Shimizu, Masahiro; Horita, Masaomi
MATERIALS LETTERS, 303, 130504, 15 Nov. 2021, Refereed
Lead

Fabrication of Roughened Electrodeposited Copper Coating on Steel for Dissimilar Joining of Steel and Thermoplastic Resin
Arai, Susumu; Iwashita, Ryosuke; Shimizu, Masahiro; Inoue, Junki; Horita, Masaomi; Nagaoka, Takashi; Itabashi, Masami
METALS, 11(4), 591, 25 Apr. 2021, Refereed
Lead

Dopant Effect on Lithiation/Delithiation of Highly Crystalline Silicon Synthesized Using the Czochralski Process
Shimizu, Masahiro; Kimoto, Kohei; Kawai, Takuya; Taishi, Toshinori; Arai, Susumu
ACS APPLIED ENERGY MATERIALS, 4(8), 7922-7929, 2021, Refereed

Intercalation/deintercalation of solvated Mg2+ into/from graphite interlayers
Shimizu, Masahiro; Nakahigashi, Atsuhito; Arai, Susumu
PHYSICAL CHEMISTRY CHEMICAL PHYSICS, 23(31), 16981-16989, 2021, Refereed

Fabrication of metal/carbon nanotube composites by electrochemical deposition (Review)
Arai, Susumu
ELECTROCHEM, 2(4), 563-589, 2021, Refereed
Lead

粗面化めっき膜を利用した鉄鋼と樹脂の異種材料接合（解説）
新井　進
表面技術, 72(12), 34-38, 2021
Lead

Kinetics Study and Degradation Analysis through Raman Spectroscopy of Graphite as a Negative-Electrode Material for Potassium-Ion Batteries
Shimizu, Masahiro; Koya, Taro; Nakahigashi, Atsuhito; Urakami, Noriyuki; Yamakami, Tomohiko; Arai, Susumu
JOURNAL OF PHYSICAL CHEMISTRY C, 124(24), 13008-13016, 2020, Refereed

Dispersion of multiwalled carbon nanotubes into a diglyme solution, electrodeposition of aluminum-based composite, and improvement of hardness
Zhang, Zelei; Kitada, Atsushi; Chen, Tianyu; Fukami, Kazuhiro; Shimizu, Masahiro; Arai, Susumu; Yao, Zhengjun; Murase, Kuniaki
JOURNAL OF ALLOYS AND COMPOUNDS, 816, 152585, 2020, Refereed

Multi-layered copper foil reinforced by co-deposition of single-walled carbon nanotube based on electroplating technique
Shimizu, Masahiro; Ogasawara, Takayuki; Ohnuki, Tomonari; Arai, Susumu
MATERIALS LETTERS, 261, 126993, 2020, Refereed

Excellent bonding strength between steel and thermoplastic resin using roughened electrodeposited Ni/CNT composite layer without adhesives
Arai, Susumu; Sugawara, Ryo; Shimizu, Masahiro; Inoue, Junki; Horita, Masaomi; Nagaoka, Takashi; Itabashi, Masami
MATERIALS LETTERS, 263, 127241, 2020, Refereed
Lead

粗面化めっき法を活用した鉄鋼と樹脂の異種材料接合
新井　進
溶接学会誌, 89, 21-24, 2020
Lead

Superior Durability of Dissimilar Material Joint between Steel and Thermoplastic Resin with Roughened Electrodeposited Nickel Interlayer
Arai, Susumu; Sugawara, Ryo; Shimizu, Masahiro; Inoue, Junki; Horita, Masaomi; Nagaoka, Takashi; Itabashi, Masami
ADVANCED ENGINEERING MATERIALS, 22(12), 2000739, 2020, Refereed
Lead

Electrodeposition of Ag/CNT Composite Films from Iodide Plating Baths
Arai, Susumu; Kikuhara, Taishi; Shimizu, Masahiro; Horita, Masaomi
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 167(12), 122515, 2020, Refereed
Lead

Fabrication of CNT/Cu Composite Yarn via Single-Step Electrodeposition
Arai, Susumu; Murakami, Ichiro; Shimizu, Masahiro; Oshigane, Akimasa
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 167(10), 102509, 2020, Refereed
Lead

Fabrication of high thermal conductivity copper/diamond composites by electrodeposition under potentiostatic conditions
Arai, Susumu; Ueda, Miyoka
JOURNAL OF APPLIED ELECTROCHEMISTRY, 50(5), 631-638, 2020, Refereed
Lead

Tin Oxides as a Negative Electrode Material for Potassium-Ion Batteries
Shimizu, Masahiro; Yatsuzuka, Ryosuke; Koya, Taro; Yamakami, Tomohiko; Arai, Susumu
ACS APPLIED ENERGY MATERIALS, 1(12), 6865-6870, 2019, Refereed

Micro-Brazing of Stainless Steel Using Ni-P Alloy Plating
Liu, Shubin; Shohji, Ikuo; Iioka, Makoto; Hashimoto, Anna; Hirohashi, Junichiro; Wake, Tsunehito; Arai, Susumu
APPLIED SCIENCES-BASEL, 9(6), 1094(9pages), 2019, Refereed

Morphology control of zinc electrodeposition by surfactant addition for alkaline-based rechargeable batteries
Shimizu, Masahiro; Hirahara, Koichi; Arai, Susumu
PHYSICAL CHEMISTRY CHEMICAL PHYSICS, 21(13), 7045-7052, 2019, Refereed

Communication-Alkyl-Chain-Length Dependence of Quaternary Ammonium Cation on Zn Deposition Morphology in Alkaline-Based Electrolytes
Shimizu, Masahiro; Hirahara, Koichi; Ishida, Yuki; Arai, Susumu
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 166(10), A2242-A2244, 2019, Refereed

Electrodeposited Cu/MWCNT composite-film: a potential current collector of silicon-based negative-electrodes for Li-Ion batteries
Shimizu, Masahiro; Ohnuki, Tomonari; Ogasawara, Takayuki; Banno, Taketoshi; Arai, Susumu
RSC ADVANCES, 9(38), 21939-21945, 2019, Refereed

Fabrication of high thermal conductivity Cu/diamond composites at ambient temperature and pressure
Arai, Susumu; Ueda, Miyoka
AIP ADVANCES, 9(8), 085309, 2019, Refereed
Lead

カーボンナノチューブ複合めっき（解説）
新井　進
溶接学会誌, 87(6), 34-39, 2018, Invited
Lead

Suppressing the effect of lithium dendritic growth by the addition of magnesium bis(trifluoromethanesulfonyl)amide
Shimizu, Masahiro; Umeki, Makoto; Arai, Susumu
PHYSICAL CHEMISTRY CHEMICAL PHYSICS, 20(2), 1127-1133, 2018, Refereed

Field emission properties of a DWCNT bundle and a single MWCNT
Fujishige, Masatsugu; Wongwiriyapan, Winadda; Muramatsu, Hiroyuki; Takeuchi, Kenji; Arai, Susumu
JOURNAL OF PHYSICS AND CHEMISTRY OF SOLIDS, 113, 229-234, 2018, Refereed

Electrochemical preparation of free-standing carbon-nanotube/Sn composite paper
Shimizu, Masahiro; Shimizu, Shunya; Katada, Arinobu; Uejima, Mitsugu; Arai, Susumu
MATERIALS LETTERS, 220, 182-185, 2018, Refereed

Communication-Intercalation/De-Intercalation Behavior of Li-Ion Encapsulated by 12-Crown-4-Ether into Graphite Electrode
Shimizu, Masahiro; Koya, Taro; Umeki, Makoto; Arai, Susumu
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 165(13), A3212-A3214, 2018, Refereed

Li-insertion/extraction properties of three-dimensional Sn electrode prepared by facile electrodeposition method
Shimizu, Masahiro; Munkhbat, Mendsaikhan; Arai, Susumu
JOURNAL OF APPLIED ELECTROCHEMISTRY, 47(6), 727-734, 2017, Refereed

Fabrication of Copper/Single-Walled Carbon Nanotube Composites by Electrodeposition Using Free-Standing Nanotube Film
Arai, Susumu; Kirihata, Kyohei; Shimizu, Masahiro; Ueda, Miyoka; Katada, Arinobu; Uejima, Mitsugu
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 164(13), D922-D929, 2017, Refereed
Lead

Electrochemical Na-Insertion/Extraction Property of Ni-Coated Black Phosphorus Prepared by an Electroless Deposition Method
Shimizu, Masahiro; Tsushima, Yuji; Arai, Susumu
ACS OMEGA, 2(8), 4306-4315, 2017, Refereed

Design of Roughened Current Collector by Bottom-up Approach Using the Electroplating Technique: Charge-Discharge Performance of a Sn Negative-Electrode for Na-Ion Batteries
Shimizu, Masahiro; Yatsuzuka, Ryosuke; Horita, Masaomi; Yamamoto, Takahiro; Arai, Susumu
JOURNAL OF PHYSICAL CHEMISTRY C, 121(49), 27285-27294, 2017, Refereed

Communication-Micro-Scale Columnar Architecture Composed of Copper Nano Sheets by Electrodeposition Technique
Arai, Susumu; Ozawa, Masaya; Shimizu, Masahiro
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 164(2), D72-D74, 2017, Refereed
Lead

Communication-Fabrication of a Uniformly Tin-Coated Three-Dimensional Copper Nanostructured Architecture by Electrodeposition
Arai, Susumu; Mendsaikhan, Munkhbat; Nishimura, Koichi
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 163(2), D54-D56, 2016
Lead

A carbon nanotube-reinforced noble tin anode structure for lithium-ion batteries
Arai, Susumu; Fukuoka, Ryosuke
JOURNAL OF APPLIED ELECTROCHEMISTRY, 46(3), 331-338, 2016
Lead

Fabrication of copper/single-walled carbon nanotube composite film with homogeneously dispersed nanotubes by electroless deposition
Arai, Susumu; Osaki, Takuma; Hirota, Mitsuhito; Uejima, Mitsugu
MATERIALS TODAY COMMUNICATIONS, 7, 101-107, 2016, Refereed
Lead

Fabrication of Three-Dimensional (3D) Copper/Carbon Nanotube Composite Film by One-Step Electrodeposition
Arai, Susumu; Ozawa, Masaya; Shimizu, Masahiro
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 163(14), D774-D779, 2016, Refereed
Lead

ダイヤモンドおよびカーボンナノチューブを用いた複合めっき膜の熱特性
新井　進
表面技術, 66(6), 252-255, 2015
Lead

カーボンナノチューブ複合めっき膜の作製とその特性
新井　進
防錆管理, 59(7), 1-6, 2015
Lead

Fabrication of Copper/Multiwalled Carbon Nanotube Composites Containing Different Sized Nanotubes by Electroless Deposition
Arai, Susumu; Osaki, Takuma
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 162(1), D68-D73, 2015, Refereed
Lead

Simple Method for Fabrication of Three-Dimensional (3D) Copper Nanostructured Architecture by Electrodeposition
Arai, Susumu; Kitamura, Tomoya
ECS ELECTROCHEMISTRY LETTERS, 3(5), D1-D3, May 2014, Refereed
Lead

カーボンナノチューブを用いた複合めっき
新井　進
表面技術, 65(2), 20-25, Feb. 2014, Refereed
Lead

電析Co/Cu多層膜の層厚に依存した磁気特性の変化
高根直人，成田　博，曽根原浩幸，劉　小晰，新井　進
表面技術, 65(2), 99-103, Feb. 2014, Refereed

Electroless Deposition of Cu/Multiwalled Carbon Nanotube Composite Films with Improved Frictional Properties
Arai, Susumu; Kanazawa, Taishi
ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, 3(6), P201-P206, 2014, Refereed
Lead

Electroless deposition and evaluation of Cu/multiwalled carbon nanotube composite films on acrylonitrile butadiene styrene resin
Arai, Susumu; Kanazawa, Taishi
SURFACE & COATINGS TECHNOLOGY, 254, 224-229, 2014, Refereed
Lead

Magnetic Properties and Microstructure of Electrodeposited Co/Cu Multilayers
Takane, Naoto; Narita, Hiroshi; Liu, Xiaoxi; Arai, Susumu
ELECTROCHEMISTRY, 81(12), 966-970, Dec. 2013, Refereed

Fabrication of Co-W Alloy/Multiwalled Carbon Nanotube Composite Films by Electrodeposition for Improved Frictional Properties
Arai, Susumu; Miyagawa, Kazuaki
ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, 2(11), M39-M43, Nov. 2013, Refereed
Lead

Mechanism for Codeposition of Multiwalled Carbon Nanotubes with Copper from Acid Copper Sulfate Bath
Arai, Susumu; Kato, Akihiro
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 160(9), D380-D385, Sep. 2013, Refereed
Lead

Frictional and wear properties of cobalt/multiwalled carbon nanotube composite films formed by electrodeposition
Arai, Susumu; Miyagawa, Kazuaki
SURFACE & COATINGS TECHNOLOGY, 235, 204-211, Jul. 2013, Refereed
Lead

Field emission properties of cobalt/multiwalled carbon nanotube composite films fabricated by electrodeposition
Arai, Susumu; Miyagawa, Kazuaki
APPLIED SURFACE SCIENCE, 280, 957-961, May 2013, Refereed
Lead

Crystal structure of Co/Cu multilayers prepared by pulse potential electrodeposition with precisely controlled ultrathin layer thickness
Takane, Naoto; Narita, Hiroshi; Kurogouchi, Yasuko; Arai, Susumu
AIP ADVANCES, 3(2), 022119, 2013, Refereed

Field emission properties of Cu/multiwalled carbon nanotube composite films fabricated by an electrodeposition technique
Arai, Susumu; Shinada, Eri; Saito, Takashi
JOURNAL OF APPLIED ELECTROCHEMISTRY, 43(4), 399-405, 2013, Refereed
Lead

Fabrication of metal coated carbon nanotubes by electroless deposition for improved wettability with molten aluminum
Arai, Susumu; Suzuki, Yosuke; Nakagawa, Junshi; Yamamoto, Tohru; Endo, Morinobu
SURFACE & COATINGS TECHNOLOGY, 212, 207-213, 2012, Refereed
Lead

Effectiveness of Coulostatic Electrodeposition of Multilayers
Takane, Naoto; Narita, Hiroshi; Arai, Susumu
Journal of the Surface Finishing Society of Japan, 62(9), 463-468, Sep. 2011, Refereed

Improved Electrodeposited Multi layer Structure by Coulomb Controller
Takane, Naoto; Narita, Hiroshi; Arai, Susumu
ELECTROCHEMISTRY, 79(7), 558-560, Jul. 2011, Refereed

Electroless Deposition of Silver on Multiwalled Carbon Nanotubes Using Iodide Bath
Arai, Susumu; Fujii, Junko
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 158(8), D506-D510, Jun. 2011, Refereed
Lead

Fabrication of Ni-B alloy coated vapor-grown carbon nanofibers by electroless deposition
Arai, Susumu; Imoto, Yuzo; Suzuki, Yosuke; Endo, Morinobu
CARBON, 49(4), 1484-1490, Apr. 2011, Refereed
Lead

Development of Measurement and Analysis System for Electrolytic Current and Application to Multilayer Electrodeposition with a Coulomb Controller
Takane, Naoto; Narita, Hiroshi; Arai, Susumu
ELECTROCHEMISTRY, 79(3), 156-162, 2011, Refereed

Fabrication of various electroless Ni-P alloy/multiwalled carbon nanotube composite films on an acrylonitrile butadiene styrene resin
Arai, Susumu; Sato, Toshihiko; Endo, Morinobu
SURFACE & COATINGS TECHNOLOGY, 205(10), 3175-3181, 2011, Refereed
Lead

Cu/Multiwalled Carbon Nanotube Composite Films Fabricated by Pulse-Reverse Electrodeposition
Arai, Susumu; Suwa, Yoriyuki; Endo, Morinobu
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 158(2), D49-D53, Dec. 2010, Refereed
Lead

Ni-P alloy-carbon black composite films fabricated by electrodeposition
Suzuki, Yosuke; Arai, Susumu; Endo, Morinobu
APPLIED SURFACE SCIENCE, 256(22), 6914-6917, Sep. 2010, Refereed

Fabrication of Various Electroless Ni-P Alloy/Multiwalled Carbon Nanotube Composite Films and Their Frictional Properties
Arai, Susumu; Sato, Toshihiko; Endo, Morinobu
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 157(11), D570-D576, Sep. 2010, Refereed
Lead

Pure-Nickel-Coated Multiwalled Carbon Nanotubes Prepared by Electroless Deposition
Arai, Susumu; Kobayashi, Mitsuhiro; Yamamoto, Tohru; Endo, Morinobu
ELECTROCHEMICAL AND SOLID STATE LETTERS, 13(12), D94-D96, Sep. 2010, Refereed
Lead

Electric Contact Characteristic under Low Load of Silver-Carbon Nanotube Composite Plating Film Corroded Using H2S Gas
Fujishige, Masatsugu; Sekino, Mitsuru; Fujisawa, Kazunori; Morimoto, Shingo; Takeuchi, Kenji; Arai, Susumu; Kawai, Akimasa
APPLIED PHYSICS EXPRESS, 3(6), 065801(1-3), 2010, Refereed

Effects of Additives on Cu-MWCNT Composite Plating Films
Arai, Susumu; Saito, Takashi; Endo, Morinobu
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 157(3), D127-D134, 2010, Refereed
Lead

Cu-MWCNT Composite Films Fabricated by Electrodeposition
Arai, Susumu; Saito, Takashi; Endo, Morinobu
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 157(3), D147-D153, 2010, Refereed
Lead

Boron Particle Composite Plating with Ni-B Alloy Matrix
Arai, Susumu; Kasai, Shuji; Shohji, Ikuo
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 157(2), D119-D125, 2010, Refereed
Lead

Electrodeposition of Ni-P Alloy-Multiwalled Carbon Nanotube Composite Films
Suzuki, Yosuke; Arai, Susumu; Endo, Morinobu
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 157(1), D50-D53, 2010, Refereed

Phosphorus Particle Composite Plating with Ni-P Alloy Matrix
Suzuki, Yosuke; Arai, Susumu; Shohji, Ikuo; Kobayashi, Eiji
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 156(8), D283-D286, Jul. 2009, Refereed

ナノ結晶の硬質純金めっき膜を用いたプローブの電気接点特性の向上
藤重雅嗣，新井　進，王　峰，牛山幹夫，朴　基哲，竹内健司，森本信吾，遠藤守信
電子情報通信学会誌C, J92-C, 218-224, 2009, Refereed

Gold-Carbon Nanotube Composite Plating Film Deposited Using Non-Cyanide Bath
Fujishige, Masatsugu; Wongwiriyapan, Winadda; Wang, Feng; Park, Ki Chul; Takeuchi, Kenji; Arai, Susumu; Endo, Morinobu
JAPANESE JOURNAL OF APPLIED PHYSICS, 48(7), 070217(1-3), 2009, Refereed

マグネシウム合金溶湯に対するVGCFのぬれ性改善を目的とした表面改質処理
佐藤智之，加藤敦史，新井啓太，滝沢秀一，新井　進
表面技術, 59(4), 265-267, 2008, Refereed

Electrodeposition of Ni-P composite films using Watts base base containing phosphorus particles
Suzuki, Yosuke; Arai, Susumu; Shohji, Ikuo; Kobayashi, Eiji
Journal of the Surface Finishing Society of Japan, 59(5), 343-345, 2008, Refereed

Inter-collisional cutting of multi-walled carbon nanotubes by high-speed agitation
Park, Ki Chul; Fujishige, Masatsugu; Takeuchi, Kenji; Arai, Susumu; Morimoto, Shingo; Endo, Morinobu
JOURNAL OF PHYSICS AND CHEMISTRY OF SOLIDS, 69(10), 2481-2486, 2008, Refereed

Excellent solid lubrication of electrodeposited nickel-multiwalled carbon nanotube composite films
Arai, Susumu; Fujimori, Akihiro; Murai, Masami; Endo, Morinobu
MATERIALS LETTERS, 62(20), 3545-3548, 2008, Refereed
Lead

Metal-fixed multiwalled carbon nanotube patterned emitters using photolithography and electrodeposition technique
Arai, Susumu; Saito, Takashi; Endo, Morinobu
ELECTROCHEMICAL AND SOLID STATE LETTERS, 11(9), D72-D74, 2008, Refereed
Lead

Cu-P複合めっき
新井　進，鈴木陽介，飯高正裕，荘司郁夫，上西正久，大友　昇
表面技術, 58(2), 139-141, 2007, Refereed
Lead

Cu-P複合めっき膜のろう付特性に及ぼす添加P粒子径の影響
荘司郁夫，新井　進，狩野直樹，上西正久，大友　昇
表面技術, 58(12), 831-835, 2007, Refereed

無電解Ni-Pめっき処理アルミニウム合金とポリアセタールとの磨耗特性
荘司郁夫，新井　進，内川順一，松井孝典，小林栄仁
表面技術, 58(12), 846-850, 2007, Refereed

Development of Cu Brazing Sheet with Cu-P Composite Plating
Shohji, Ikuo ; Arai, Susumu; Kano, Naoki; Otomo, Noboru; Uenishi, Masahisa
KEY ENGINEERING MATERIALS, 353(358), 2025-2028, 2007, Refereed

Low-internal-stress nickel multiwalled carbon nanotube composite electrodeposited from a sulfamate bath
Arai, Susumu; Saito, Takashi; Endo, Morinobu
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 154(10), D530-D533, 2007, Refereed
Lead

カーボンナノチューブ複合めっき
新井　進，遠藤守信
表面技術, 57(7), 471-474, 2006
Lead

めっき講座Ⅳ（電気めっき　すず、鉛、すずー鉛合金、鉛フリーはんだめっき）
新井　進
防錆管理, 51(2), 65-70, 2006
Lead

Synthesis of carbon nanotube-supported nickel-phosphorus nanoparticles by an electroless process
Wang, Feng; Arai, Susumu; Park, Ki Chul; Takeuchi, Kenji; Kim, Yong Jung; Endo, Morinobu
CARBON, 44(7), 1298-1352, 2006, Refereed

Fabrication of nickel-multiwalled carbon nanotube composite films with excellent thermal conductivity by an electrodeposition technique
Arai, Susumu; Endo, Morinobu; Sato, Tomoyuki; Koide, Atsushi
ELECTROCHEMICAL AND SOLID STATE LETTERS, 9(8), C131-C133, 2006, Refereed
Lead

Various carbon nanofiber-copper composite films prepared by electrodeposition
Arai, Susumu; Endo, Morinobu
ELECTROCHEMISTRY COMMUNICATIONS, 7(1), 19-22, 2005, Refereed
Lead

Preparation of nickel-carbon nanofiber composites by a pulse-reverse electrodeposition process
Wang, Feng; Arai, Susumu; Endo, Morinobu
ELECTROCHEMISTRY COMMUNICATIONS, 7(7), 674-678, 2005, Refereed

The preparation of multi-walled carbon nanotubes with a Ni-P coating by an electroless deposition process
Wang, Feng; Arai, Susumu; Endo, Morinobu
CARBON, 43(8), 1716-1721, 2005, Refereed

Sn-Ag-Cu Alloy Electroplating from Acid Sulfate Baths for Pb-free Solder
Kaneko, Norio; Komatsu, Motoyasu; Kurashina, Tadashi; Arai, Susumu; Shinohara, Naoyuki
ELECTROCHEMISTRY, 73(11), 951-955, 2005, Refereed

はんだの鉛フリー化に対応しためっき技術の現状と課題
新井　進
表面技術, 55(9), 576-581, 2004
Lead

Effect of S on passivation of Ni plating
Arai, Susumu; Hasegawa, Takahide; Kaneko, Norio
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 151(1), C15-C18, 2004, Refereed
Lead

Fabrication of three-dimensional Cu/Ni multilayered microstructure by wet process
Arai, Susumu; Hasegawa, Takahide; Kaneko, Norio
ELECTROCHIMICA ACTA, 49(6), 945-950, 2004, Refereed
Lead

Electrochemical preparation and characterization of nickel/Ultra-Dispersed PTFE composite films from aqueous solution
Wang, Feng; Arai, Susumu; Endo, Morinobu
MATERIALS TRANSACTIONS, 45(4), 1311-1316, 2004, Refereed

Metallization of multi-walled carbon nanotubes with copper by an electroless deposition process
Wang, Feng; Arai, Susumu; Endo, Morinobu
ELECTROCHEMISTRY COMMUNICATIONS, 6(10), 1042-1044, 2004, Refereed

Ni-fluorinated vapor growth carbon fiber (VGCF) composite films prepared by an electrochemical deposition process
Wang, Feng; Arai, Susumu; Morimoto, Shingo; Endo, Morinobu
ELECTROCHEMISTRY COMMUNICATIONS, 6(3), 242-244, 2004, Refereed

Electrodeposition of Au-Sn alloy from a sulfite-pyrophosphate bath
Funaoka, Yoshikazu; Arai, Susumu; Endo, Morinobu
ELECTROCHEMISTRY, 72(2), 98-102, 2004, Refereed

Carbon nanofiber-copper composites fabricated by electroplating
Arai, Susumu; Endo, Morinobu
ELECTROCHEMICAL AND SOLID STATE LETTERS, 7(3), C25-C26, 2004, Refereed
Lead

Ni-deposited multi-walled carbon nanotubes by electrodeposition
Arai, Susumu; Endo, Morinobue; Kaneko, Norio
CARBON, 42(3), 641-644, 2004, Refereed
Lead

Nickel-coated carbon nanofibers prepared by electroless deposition
Arai, Susumu; Endo, Morinobu; Hashizume, Shinji; Shimojima, Yasuho
ELECTROCHEMISTRY COMMUNICATIONS, 6(10), 1029-1031, 2004, Refereed
Lead

Sn-Ag alloy electroplating for Pb-free solder from acid sulfate baths in the presence of N,N-bis(polyoxyethylene)octadecylamine
Kaneko, Norio; Shiraya, Yuki; Arai, Susumu; Shinohara, Naoyuki
ELECTROCHEMISTRY, 71(5), 322-326, 2003, Refereed

Carbon nanofiber-copper composite powder prepared by electrodeposition
Arai, Susumu; Endo, Morinobu
ELECTROCHEMISTRY COMMUNICATIONS, 5(9), 797-799, 2003, Refereed
Lead

Sn-Cu solder bump formation from acid sulfate baths using electroplating method
Kaneko, Norio; Seki, Masako; Arai, Susumu; Shinohara, Naoyuki
ELECTROCHEMISTRY, 71(9), 791-794, 2003, Refereed

Sn-Ag solder bump formation for flip-chip bonding by electroplating
Arai, Susumu; Akatsuka, Hideki; Kaneko, Norio
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 150(10), C730-C734, 2003, Refereed
Lead

Fabrication of 3-D Ni/Cu multilayered microstructure by selective etching of Ni
Arai, Susumu; Hasegawa, Takahide; Kaneko, Norio
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 150(11), C798-C801, 2003, Refereed
Lead

鉛フリーはんだの現状と展望　電気めっき法による鉛フリーはんだバンプの作製
新井　進
科学と工業, 76(10), 525-531, 2002
Lead

Electroless Sn-Ag alloy plating by displacement reaction
Arai, Susumu; Kumagai, Masanobu; Kaneko, Norio; Naoyuki, Shinohara
ELECTROCHEMISTRY, 70(5), 311-315, 2002, Refereed
Lead

はんだの鉛フリー化に対応しためっき技術の現状
新井　進，金子紀男，篠原直行
表面技術, 52(5), 369-373, 2001
Lead

電気めっき法によるフリップチップ接合用鉛フリーはんだバンプの作製
新井　進，金子紀男，篠原直行
セラミックス, 36(6), 430-433, 2001
Lead

Microstructure of Electrodeposited Sn-Ag-Cu Ternary Alloys
Arai, Susumu; Kanekom Norio; Shinohara, Naoyuki
表面科学, 22(7), 463-469, 2001, Refereed
Lead

電位パルス電解法によるCu/Cu-Sn合金積層皮膜の作製
篠原直行，新井　進，金子紀男，若林信一
表面技術, 52(10), 693-697, 2001, Refereed

Polarographic study on the smoothing of Sn-Ag alloy film electrodeposited from pyrophosphate-iodide bath
Arai, Susumu; Kaneko, Norio; Shinohara, Naoyuki
ELECTROCHEMISTRY, 69(4), 254-258, 2001, Refereed
Lead

Sn-Cu alloy electroplating from acid sulfate baths for Pb-free solder
Kaneko, Norio; Seki, Masako; Arai, Susumu; Shinohara, Naoyuki
ELECTROCHEMISTRY, 69(5), 329-334, 2001, Refereed

Electrodeposition of Sn-Cu alloy from pyrophosphate bath
Arai, Susumu; Funaoka, Yoshikazu; Kaneko, Norio; Shinohara, Naoyuki
ELECTROCHEMISTRY, 69(5), 319-323, 2001, Refereed
Lead

ASTM腐食水中におけるDICHANのSPCCへの腐食抑制機構の電気化学的評価
新井　進，篠原直行，金子紀男
防錆管理, 44(2), 41-44, 2000, Refereed
Lead

ASTM腐食水中におけるDICHANのSPCCへの腐食抑制機構のSTMによるin-situ評価
新井　進，篠原直行，金子紀男
防錆管理, 44(3), 81-85, 2000, Refereed
Lead

日本における溶接の展望1998 (Ⅲ-4 マイクロ接合)
新井　進
溶接学会誌, 68(5), 376-378, 1999
Lead

鉛フリーはんだ接合に対応しためっきの現状
新井　進，篠原直行，金子紀男
まてりあ, 38(12), 951-955, 1999
Lead

Pbフリーはんだ用Sn-Ag合金めっき
新井　進，渡邊　徹
表面技術, 49(1), 73-77, 1998, Refereed
Lead

非シアン浴からのスズ－銀合金めっき
新井　進
表面技術, 49(3), 230-234, 1998
Lead

日本における溶接の展望1997 (Ⅲ-4 マイクロ接合)
新井　進
溶接学会誌, 67(5), 405-407, 1998
Lead

Microstructure of Sn-Ag Alloys Electrodeposited from Pyrophosphate-Iodide Solutions
Arai, Susumu; Watanabe, Tohru
MATERIALS TRANSACTIONS, 39(4), 439-445, 1998, Refereed
Lead

日本における溶接の展望1996 (Ⅲ-4 マイクロ接合)
新井　進
溶接学会誌, 66(5), 361-363, 1997
Lead

Electrodeposition of Sn-Ag-Cu alloys
Arai, Susumu; Kaneko, Norio
DENKI KAGAKU, 65(12), 1102-1106, 1997, Refereed
Lead

Electrodeposition of Sn-Ag alloy with a non-cyanide bath
Arai, Susumu; Watanabe, Tohru
DENKI KAGAKU, 65(12), 1097-1101, 1997, Refereed
Lead

低温純水中におけるAl-Mg合金表面の酸化膜成長過程
塩沢玲子，沖　恭一，新井　進
材料と環境, 45(10), 609-613, 1996, Refereed

Crystal Structure and Microstructure of Electrodeposited Sn-Ag Alloys
Arai, Susumu; Watanabe, Tohru
日本金属学会誌, 60(12), 1149-1154, 1996, Refereed
Lead

水洗浄工程における鉄鋼の防錆
新井　進，小池明夫，仁科耕一，鳥羽正司
防錆管理, 39(2), 52-57, 1995, Refereed
Lead

過剰電流密度で電析したニッケル皮膜
新井　進
表面技術, 44(4), 336-340, 1993, Refereed
Lead

過剰電流密度で形成したニッケルめっきのはんだ付性
新井　進，竹本　正，水谷正海，征矢　隆
表面技術, 44(1), 50-54, 1993, Refereed
Lead

水素チャージしたニッケルおよび銅のはんだ付性
新井　進
表面技術, 43(11), 1079-1080, 1992, Refereed
Lead

接着界面解析と次世代接着接合技術
新井　進, Joint work
エヌ・ティー・エス, 325-332 Jan. 2022

ナノカーボン・ナノセルロースの分散・配向制御技術
新井　進, Joint work
CMC出版, 67-77頁 2021

リチウムイオン二次電池用炭素系負極材の開発動向，第II編第7章 めっき技術を用いたリチウムイオン電池用CNT/Sn電極の開発
清水雅裕、新井 進, Joint work
CMC出版, 104-110頁 2019

リチウムイオン二次電池用シリコン系負極材の開発動向，第 II 編第3章 シリコン負極用高比表面積銅系集電体
清水雅裕、新井 進, Joint work
CMC出版, 172-182頁 2019

カーボンナノチューブの表面処理・分散技術と複合化事例，第7章第3節 カーボンナノチューブ複合めっき基板の集電体への応用
清水雅裕、新井 進, Joint work
CMC出版, 232-239頁 2019

Novel Metal Electrodeposition and the Application toward MEMS Device
Masatsugu Fujishige and Susumu Arai, Joint work, Hard Pure-Gold and Gold-CNT Composite Plating using Electrodeposition Technique with Environmentally Freiendly Sulfite Bath.
InTech, 17pages 2018

次世代電池用電極材料の高エネルギー密度、高出力化－リチウム過剰系正極、三元系正極、シリコン系負極、ポストリチウムイオン電池－（分担執筆）
清水雅裕、新井 進, Joint work
情報技術協会, pp.422-431 Nov. 2017

最新フォトレジスト材料開発とプロセス最適化技術「フォトレジストを用いた電気めっき法による微細金属構造の創製」（分担執筆）
新井　進、清水雅裕, Joint work
CMC出版, pp.261-269 Jan. 2017

カーボンナノチューブ・グラフェン分散技術の工業化と機能展開
新井　進, Joint work
S&T出版, 39-48頁 26 Feb. 2014

マイクロ接合・実装技術
新井　進, Joint work
㈱産業技術サービスセンター技術サービスセンター, 57-62頁 Jul. 2012

標準マイクロソルダリング技術第3版
新井　進, Joint work
日刊工業新聞社, 81-85頁 Mar. 2011

ナノカーボンハンドブック
新井　進, Joint work
エヌ・ティー・エス, 449-453頁 Jul. 2007

環境対応型表面処理技術
新井　進, Joint work
㈱テクノシステム, 323-332頁 Aug. 2005

標準マイクロソルダリング
新井　進, Joint work
日刊工業新聞社, 35-39頁 Aug. 2002

「防食・防錆技術総監」
新井　進, Joint work
㈱産業技術サービスセンター, 915-918頁 May 2000

American Chemical Society

The Chemical Society of Japan

The Electrochemical Society of Japan

The Japan Institute of Metals and Materials

The Japan Society for Analytical Chemistry

The Japan Institute of Electronics Packaging

The surface finishing society of japan

Japan Welding Society

The Carbon Society of Japan

The Electrochemical Society

Smart Processing Society for Materials, Environment & Energy

カーボンナノチューブ複合めっき法を活用した新規リチウムイオン電池負極構造の構築（基盤研究B）
科学研究費補助金, JSPS
2014 - 2016

電鋳端子用めっき液とめっき膜の開発
共同研究, 精研㈱
2014 - 2014

CNTめっきによる複合材料膜の作製
共同研究, KOA㈱
2014 - 2014

貴金属複合めっきの研究
共同研究, オリンパス㈱
2014 - 2014

めっき技術によるSGCNT/Cu複合化技術開発
共同研究, 日本ゼオン㈱
2013 - 2014

電解Ruめっき皮膜の特性に関する研究
共同研究, 日本エレクトロプレイティング・エンジニャース㈱
2013 - 2014

鍍金技術によるブレーキキャリパー用アルミピストンの表面特性向上
共同研究, 日信工業㈱
2013 - 2014

グリーンイノベーション研究支援事業『導電性シリコン粒子を用いた次世代蓄電池用負極の創製』
信州大学
2013 - 2013

炭素材料複合めっきに関する研究
共同研究, 新光電気工業㈱
2013 - 2013

カーボン複合めっきの研究開発
共同研究, パナソニック㈱
2013 - 2013

電鋳端子用めっき液とめっき膜の開発
共同研究, 精研㈱
2013 - 2013

炭素材料複合めっきに関する研究
共同研究, 新光電気工業㈱
2011 - 2012

ナノカーボン複合めっきの研究開発
共同研究, パナソニック㈱
2011 - 2011

カーボンナノチューブ複合めっきの共析メカニズムの解明（基盤研究C）
科学研究費補助金, JSPS
2010 - 2012

炭素材料複合めっきに関する研究
共同研究, 新光電気工業㈱
2010 - 2011

カーボンナノチューブ複合めっきの研究開発
共同研究, パナソニック電工㈱
2010 - 2010

工学研究助成
西工業㈱
2010

CNT複合銅めっきに関する研究
共同研究, 新光電気工業㈱
2009 - 2010

機能性表面処理皮膜の作製・評価
受託事業, 長野県工業技術センター
2009 - 2009

低抵抗・低ＴCRめっきの開発
共同研究, KOA㈱
2009 - 2009

複合めっきによるはんだ鏝先の高寿命化
共同研究, 長野沖電気㈱
2009 - 2009

ナノカーボン複合めっきの研究開発
共同研究, パナソニック電工㈱
2009 - 2009

工学研究助成
村田製作所㈱
2009

工学研究助成
富士電機デバイステクノロジー
2009

工学研究助成
西工業㈱
2009

経済産業省戦略的基盤技術高度化支援事業『ナノ粒を用いた高機能複合めっき加工技術の開発』
経済産業省戦略的基盤技術高度化支援事業
2008 - 2010

白金複合めっき
共同研究, ㈱カワジュンインダストリー
2008 - 2009

ナノカーボン複合めっきの研究開発
共同研究, 松下電工㈱
2008 - 2008

めっき皮膜計測方法の確立
共同研究, KOA㈱
2008 - 2008

高機能複合めっきの研究
共同研究, ㈱メイコー
2008 - 2008

工学研究助成
富士電機デバイステクノロジー
2008

機能性炭素系複合めっきの開発
共同研究, ｾｲｺｰｴﾌﾟｿﾝ㈱
2007 - 2008

ナノカーボン複合めっきの研究開発
共同研究, 松下電工㈱
2007 - 2007

高機能複合めっきの研究
共同研究, ㈱メイコー
2007 - 2007

複合めっきの研究開発
共同研究, 信越富士通㈱
2007 - 2007

Ni合金複合めっきによるアルミニウム製機構部品の表面硬化
共同研究, 仁テック（有）
2007 - 2007

工学研究助成
信越富士通㈱
2007

工学研究助成
中澤鋳造
2007

機能性複合めっきの開発
共同研究, ｾｲｺｰｴﾌﾟｿﾝ㈱
2006 - 2007

機能性ナノコンポジット複合めっきの開発に関する研究
共同研究, ㈱しなの富士通
2006 - 2007

Ni合金複合めっきの開発
共同研究, 日精樹脂工業㈱
2006 - 2007

ニッケル/潤滑性ナノ粒子複合めっき浴の開発
受託事業, 福島県ハイテクプラザ
2006 - 2006

機能めっきによる接点の性能向上に関する研究
共同研究, ㈱エルグ
2006 - 2006

鉛フリー化に伴うPT基板表面処理の研究開発
共同研究, ㈱メイコー
2006 - 2006

銅材料の表面に複合めっき法によりろう材層を製造する実用化(量産化）研究
共同研究, ㈱アタゴ製作所
2006 - 2006

カーボンナノチューブ複合めっきの研究開発
共同研究, 松下電工㈱
2006 - 2006

工学研究助成
メイコー
2006

分散めっき法によるCu-P合金膜の作製
共同研究, ㈱アタゴ製作所
2005 - 2005

ナノ粒子分散めっき法によるアルミニウム表面硬化層の創製
共同研究, 仁テック
2004 - 2004

分散めっき法によるCu-P合金膜の作製
共同研究, ㈱アタゴ製作所
2004 - 2004

工学研究助成
荘司郁夫
2003

めっき法による多層電極形成技術開発
共同研究, 三菱電機（株）先端技術総合研究所
2002 - 2002

工学研究助成
三菱電機（株）先端技術総合研究所
2002

NEDOプロジェクト『鉛フリーはんだ規格化等研究開発』
NEDO
1998 - 1999

Fabrication of carbon nanotube/metal composite yarns by electrodeposition

Dissimilar Materials Joining using Plating Techniques

Carbon Nanotube Composite Plating

Functional Alloy Plating